Capillary is suited for fine pitch wire bonding.

Thursday, January 11th 2007

Expanding upon the capabilities of its highly successful copper capillary called CuPRA, Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) has developed the CuPRAplus(TM) that supports highly consistent and stable fine wire 2nd bonds, while maintaining the quality of the overall wire bonding process. By ensuring both 1st and 2nd bond quality during fine copper wire bonding, the CuPRAplus Copper Capillary offers a more stable mass production process. “The...